Taiwan Semiconductor Manufacturing Co. said May revenue rose 30.1% from a year earlier to NT$417 billion, keeping the world’s largest contract chipmaker on pace for its second-quarter target amid persistent AI demand.

Taiwan Semiconductor Manufacturing Co. said May revenue rose 30.1% from a year earlier, a monthly update that keeps the world’s largest contract chipmaker on pace for its second-quarter target.

The company reported May sales of NT$417 billion, or about $13.2 billion, up 1.5% from April. The result leaves TSMC tracking toward its second-quarter revenue guidance of $39.0 billion to $40.2 billion.

TSMC’s monthly sales reports are closely watched because they offer a quick read on demand for advanced chips used in artificial intelligence infrastructure and other high-end electronics. The company supplies leading chip designers including Nvidia, AMD, Apple and Broadcom.

Why it matters

The May result adds to a recent run of upbeat signals from TSMC. At its annual shareholders meeting on June 4, the company reiterated that it expects full-year revenue to grow more than 30% in 2026.

Reporting around that meeting said TSMC’s executives remained bullish on AI-chip demand, while warning that supply constraints at leading-edge process nodes are likely to persist. Chief Executive C.C. Wei has described demand as very strong and said the company is trying not to become a bottleneck.

The company’s first-quarter 2026 results already pointed in the same direction. In April, TSMC reported first-quarter revenue of $35.9 billion and raised its full-year revenue-growth view to above 30%.

What to watch next

Investors will now look to June sales for a better read on whether TSMC is tracking toward the midpoint of its second-quarter guidance. Another monthly update or a formal company filing would give the next concrete check on whether demand and capacity remain aligned.

For now, the May report suggests TSMC remains on plan, with AI-related demand still supporting growth and tight capacity still shaping delivery timing across the semiconductor supply chain.

Revision note

Initial automated publication.